PK608 (v1.0) may 17, 2013 www.xilinx.com 1 pk 608 ( v1.0 ) may 17 , 2013 100% material declaration data sheet for kintex ? - 7 device f b484 package average weight: 2. 0928 g component substance description cas number or description percentage of component use in product component weight/ subst ance weight (grams) component percent of total silicon die 0.182430 8.717 silicon 7440 - 21 - 3 100.00 0.182430 solder bump 0.008874 0.424 tin 7440 - 31 - 5 63.00 0.005591 lead 7439 - 92 - 1 37.00 0.003283 underfill 0.030000 1. 434 bisphenol f/ epichlorohydrin copolymer 9003 - 36 - 5 20.00 0.006000 phenolic resin trade secret 15.00 0.004500 bisphenol a type liquid epoxy resin 25068 - 38 - 6 5.00 0.001500 amine type accelerator trade secret 5.00 0.001500 silicon dioxide 60676 - 86 - 0 51.50 0.015450 carbon black 1333 - 86 - 4 1.00 0.000300 additives trade secret 2.50 0.000750 solder paste 0.002804 0.134 tin 7440 - 31 - 5 96.50 0.002706 silver 7440 - 22 - 4 3.00 0.000084 copper 7440 - 50 - 8 0.50 0.000014 solder ball 0.460670 22.013 tin 7440 - 31 - 5 63.00 0.290222 lead 7439 - 92 - 1 37.00 0.170448 capacitor 1 0.010800 0.516 batio3 type 12047 - 27 - 7 70.60 ceramic 0.007625 ni 7440 - 02 - 0 6.70 inner electrode 0.000724 cu 7440 - 50 - 8 20.10 out electrode 0.002171 ni 7440 - 02 - 0 0.80 plating1 0.000086 sn 7440 - 31 - 5 1.80 plating2 0.000194 ? copyright 2013 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included he rein are trademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet for kintex ? - 7 device fb484 package PK608 (v1.0) may 17, 2013 www.xilinx.com 2 component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 2 0.000600 0.029 batio3 type 12047 - 27 - 7 66.00 ceramic 0.000396 ni 7440 - 02 - 0 2.67 inner electrode 0.000016 cu 7440 - 50 - 8 23.33 outer electrode 0.000140 ni 7440 - 02 - 0 2.33 plating1 0.000014 sn 7440 - 31 - 5 5.67 plating2 0.000034 capacitor 3 0.005580 0.267 batio3 type 12047 - 27 - 7 51.10 ceramic 0.002851 ni 7440 - 02 - 0 27.00 inner electrode 0.001507 cu 7440 - 50 - 8 16.00 outer electrode 0.000893 glass 65997 - 17 - 3 0 .90 0.000050 ni 7440 - 02 - 0 2.00 plating1 0.000112 sn 7440 - 31 - 5 3.00 plating2 0.000167 substrate 1.390997 66.467 copper 7440 - 50 - 8 37.32 0.519064 tin 7440 - 31 - 5 1.04 0.014533 lead 7439 - 92 - 1 0.22 0.003054 silver 74 40 - 22 - 4 0.02 0.000290 bt core n/a 47.87 0.665849 abf n/a 11.10 0.154440 solder mask n/a 2.43 0.033767
100% material declaration data sheet for kintex ? - 7 device fb484 package PK608 (v1.0) may 17, 2013 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with a pplicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (contractors). all data provided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of rev isions 0 5 / 17 /2013 1.0 xilinx initial release
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